Dual Channel FT-IR Spectrometer,fourier transform spectrometer,ftir spectrometer,ftir analysis,Fourier Transform Infrared Spectroscopy,spectral analysis,quantitative analysis,qualitative analysis,diffuse reflection,specular reflection,integrating sphere,spectrometer,dual channel quad channel,dual channel,8 spectrometer,infrared spectrometer,FT-IR Spectrometer-Advanced Manufacturer,FT-NIR Spectrometers;ftir spectrometer,Optosky is a manufacturer of advanced FT-IR spectrometers, with products in stock and at affordable prices.,Fluorescence Spectrometer,Hyperspectral Camera,Fluorescence Spectrometer,ocean optic,optical microscopes,fluorescence spectroscopy,thermofisher,imaging systems,imaging platforms,confocal microscopy,hyperspectral imager,Hyperspectral Imaging systems-Advanced Manufacturer,Fluorescence Spectrometer;hyperspectral imager,Ideal for quantitative & qualitative, high sensitivity, and non-destructive measurements.Optosky Offers a Broad Range Of Spectral Solutions

Spectroscopic interference displacement multilayer film thickness measuring instrument

Measure Film Thickness
Spectroscopic interference displacement multilayer film thickness measuring instrument
SM210
EXW
1
Made in China
Quantity



Description
SM210 is a film thickness measuring instrument based on the principle of spectrophotometric interference. It uses xenon lamp light source emitted wide wavelength light, part of the workpiece surface and the sensor head internal reflection surface back to the sensor head interior, two reflective beams interfere with each other, the intensity of each wavelength of interference light depends on the spacing between the reflector surface, when the spacing is an integer multiple of the wavelength, it will reach the relative maximum interference with the help of a spectroscope interference light into different wavelengths. The light intensity distribution of the wavelength can be obtained, and the distance between the reflecting surfaces can be calculated after the waveform analysis of the distribution. The maximum mapping range of its thickness can reach 39nm-2.1um.
SM210 optical interference multilayer thickness measuring instrument is built by measuring sensor head, controller and upper computer software, combined with the unique algorithm technology of AoPU Tiancheng, to provide users with a new generation of leading multilayer thickness measuring instrument. 

Feature
  • Using xenon light source, wide band range (190nm-1100nm), high luminous efficiency and long life;
  • From single layer to multiple layers, stability measurement can be achieved;
  • Adhesion layer can also achieve stable measurement; Wide measurable range 39nm-2.1um;
  • The sensor head has no circuit, no electromagnetic interference, no heat;
  • Small, light weight, installation space is not limited;
  • The selection of"six-wind-one"type 7-core Y-type flexible optical fiber can not only adapt to frequent and high-speed movement on the production line, but also improve the utilization rate of reflected light, thereby improving the signal-to-noise ratio;
  • The software interface is intuitive, easy to operate and time-saving; Fast surveying and mapping speed;
Virtually all smooth, translucent or low absorption coefficient films can be mapped, which includes almost all dielectric and semiconductor materials, including silicon dioxide,nitriding layer,diamond-like carbon,polycrystalline silicon,polycrystalline silicon,photoresist,macromolecule,polyimide,amorphous silicon,etc.

Optical glass of Ohara and Schott
Plastic:Acrylic,Acrylate,Lucite,Perspex,Plexiglass,PET,Estar,Melinex,Mylar,Polyacrylate,Polyethylene,PE,Polyethene,Styrene - acrylanitrile,Styrene.
Semiconductor, Compound semiconductor:Aluminum gallium arsenide,Aluminium oxide,Aluminium compounds,CdTe,CoSi2,GaN,GaAs,GaP,GaSb,Indium compounds,Magnesium compounds,Si,Silicon compounds,HfO2,PbS,PbSe,
TiN,TiO2,TiSi2,ZrO2.
Metal target material:
Ag,Al,Au,Co,Cr,Cu,Ge,Mo,Nb,Ni,Pt,Rh,Ta,Ti,W
Others:AlCu,Cellulose,KCl,Quartz,Fused Silica,Fused Silica,Silica,Thermal Oxide,ThermalOxide


Application
  • Semiconductor coating: photoresist, oxide, desalination layer, silicon-on-insulator, wafer back grinding
  • Liquid crystal display: gap thickness, polyimide, ITO transparent conductive film
  • Optical coating: hard coating, anti-reflection layer
  • Microelectronic system: photoresist, silicon film, printed circuit board
  • Biomedical: medical equipment, Parylene