Automatic Optical Film Thickness Mapper

Automatic Optical Film Thickness Mapper
Single-Spot Thickness Measurements · Microscopic-Spot Thickness Measurements · Automated Thickness Mapping Systems · Inline Thickness Monitoring · Accessories.
SM230 is an automatic thin film thickness mapper developed by utilizing the principle of thin film reflected light interference. It uses the light with the widest wavelength range of 200-1700nm to vertically incident on the surface of the thin film. As long as the film has a certain degree of transmission, the SM230 can calculate the thickness of the thin film according to the reflected interference spectrum, as well as other optical constants such as reflectivity, refractive index and extinction coefficient, etc., the thickness of the maximum mapping range can reach 5nm ~ 250um.
The SM230 automatic optical thin film thickness mapping instrument is constructed by the surveying and mapping host, the surveying and mapping platform, the Y-type optical fiber and the host computer software. technology, providing users with a new generation of leading automatic optical film thickness mappers.

  • Non-contact, non-destructive testing system;
  • Ultra-long life light source, higher luminous efficiency;
  • High-resolution, high-sensitivity spectrometer, more accurate and reliable mapping results;
  • The software interface is intuitive, and the operation is convenient and time-saving;
  • The surveying and mapping speed is fast, and it supports multi-point surveying and mapping point map drawing;
  • Support drawing 2D/3D thickness distribution map of samples;
  • High-precision, long-life 3-axis rotary platform;
  • Historical data storage to help users better grasp the results;
  • Desktop distribution design, suitable for rich scenarios;
  • Low maintenance cost and convenient maintenance;
  • Biomedical: medical equipment, Parylene
  • Optical coating: hard coating, anti-reflection layer;
  • Semiconductor coating: photoresist, oxide, desalination layer, silicon-on-insulator, wafer back grinding;
  • Microelectronic system: photoresist, silicon film, printed circuit board;
  • Liquid crystal display: gap thickness, polyimide, ITO transparent conductive film;
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